How to ensure temperature uniformity in high-temperature aging test equipment during electronic component reliability verification?
Publish Time: 2025-12-23
In the research and development and production of electronic components, high-temperature aging testing is a crucial step in evaluating their long-term reliability and stability. By simulating high-temperature environments to accelerate the exposure of potential defects in devices, early failures can be effectively screened, improving overall yield. The core prerequisite for this process is that the high-temperature aging test equipment must possess excellent temperature uniformity—that is, temperature deviations at various points within the working chamber must be controlled within an extremely small range. To achieve this goal, the equipment requires systematic design and optimization across multiple dimensions, from component assembly structure and material selection to hot air circulation systems and intelligent control strategies.1. High-rigidity and low-thermal-deformation enclosure structure designThe outer shell of the high-temperature aging test equipment is made of high-quality cold-rolled steel plate, and undergoes pickling, phosphating, and electrostatic powder coating treatments. This not only improves corrosion resistance and appearance but also enhances the overall structural rigidity. The internal chamber is entirely constructed of high-quality SUS304# stainless steel. This material boasts excellent high-temperature oxidation resistance, a low coefficient of thermal expansion, and good weldability, effectively reducing deformation caused by repeated temperature fluctuations and ensuring the dimensional stability of the inner chamber. This double-layered structure, combining outer steel and inner stainless steel, provides a physical basis for stable internal temperature fields while ensuring mechanical strength, preventing airflow displacement or sealing failure due to chamber deformation, which could affect temperature uniformity.2. Scientifically Layout of the Forced Hot Air Circulation SystemThe core of temperature uniformity lies in efficient and uniform heat transfer. The equipment generally employs a horizontal or vertical forced convection airflow design, incorporating a high-power centrifugal fan and a high-precision heater. Heating elements are typically located on the sidewalls or bottom of the airflow duct. Driven by the fan, hot air is evenly blown into the chamber through guide vanes and then returns to the heating zone through the return air vent, forming a closed-loop circulation. The key lies in the fluid dynamics optimization of the airflow duct cross-section, outlet angle, and guide vane layout—ensuring airflow covers the entire effective volume without dead zones or vortices. Especially when loading multi-layer sample racks, a suitable airflow velocity can quickly equalize the temperature while avoiding disturbance to lightweight components, thus maintaining temperature fluctuations within ±0.5℃ even under full load.3. High-Precision Intelligent Temperature Control and Multi-Point Feedback MechanismThe equipment is equipped with a high-precision intelligent temperature controller, employing a fuzzy PID control algorithm. It dynamically adjusts the heating power based on real-time temperature, avoiding overshoot and oscillations caused by traditional on/off temperature control. More importantly, the temperature control system typically integrates multiple temperature sensors, distributed across the upper, middle, lower, and corner locations of the working chamber, forming a distributed temperature measurement network. The controller not only adjusts the output based on the main sensor but also monitors the temperature difference in each area in real time, making fine adjustments by regulating the damper opening or auxiliary heating units when necessary. Furthermore, an over-temperature protection device serves as a safety redundancy, automatically cutting off power in the event of main controller failure to prevent thermal runaway and ensure experimental safety and data reliability.4. Strict Factory Calibration and Usage SpecificationsEven with a well-designed hardware system, temperature uniformity still needs to be verified through standard calibration procedures. A metrology-certified multi-channel temperature recorder is used to perform full-space temperature field mapping under no-load and typical load conditions, and a uniformity test report is issued. Users should also follow specifications during use: avoid excessively dense sample stacking, regularly clean air duct filters, and ensure door seals are intact, to maintain the long-term temperature field stability of the equipment.The temperature uniformity relied upon in the reliability verification of electronic components by high-temperature aging test equipment is not the result of a single component, but rather a system capability built from high-quality materials, precision structure, intelligent control, and scientific use. From the cold-rolled steel outer shell to the SUS304 inner liner, from fuzzy PID temperature control to multi-point feedback circulating air ducts, every link provides support for "constant temperature." Only in this way can the authenticity and reliability of aging test data be ensured, laying a solid foundation for the life prediction and quality control of electronic products.
